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Ericsson and SoftBank have signed a Memorandum of Understanding (MoU) to collaborate on the development of next-generation telecom technologies, including AI, Cloud RAN, Extended Reality (XR), and 6G, aiming to establish a strategic partnership towards 2030
The partnership, built around the concept of “NextWave Tech,” Ericsson and SoftBank’s partnership, centred on NextWave Tech, aims to speed up the development of future networks by testing new technologies and business applications. They will focus on Cloud RAN deployment, AI-driven automation, and XR connectivity, while also exploring ways to improve spectrum use—particularly in centimetre Wave technology—to strengthen Japan’s position in 6G.
By working together on network roadmaps, the companies plan to stay ahead of the industry’s move towards AI-powered, cloud-based telecom infrastructure. Their goal is to make networks more efficient, cost-effective, and high-performing, shaping the future of mobile connectivity.
“This new collaboration with SoftBank marks a significant step forward in realising the full potential of AI-powered connectivity technologies. By combining our expertise in RAN and AI, we are poised to drive innovation and shape SoftBank’s future of mobile networks, empowering their technology leadership through 2030,” said Jawad Manssour, President and Representative Director of Ericsson Japan in a press release.
“Our new partnership with Ericsson allows us to explore cutting-edge solutions that will redefine network capabilities and customer experience. Our joint efforts in areas such as 6G and AI will not only enhance the performance of our network, but also pave the way for new business opportunities and technological breakthroughs,” said Hideyuki Tsukuda, EVP and CTO at SoftBank Corp.
Ericsson and SoftBank intend to align their efforts with the broader industry shift towards AI-powered, cloud-based telecom infrastructure. Last June, SoftBank was one of the founding companies of the Global Telco AI Alliance, along with Deutsche Telekom, SK Telecom, e& and Singtel. The joint venture was signed for telco AI development, with each company equally investing.
The five companies have agreed to develop Large Language Models (LLMs) that are specifically designed to meet telco needs, in areas such as improving customer interactions via digital assistants and chatbots. The LLMs will be tailored to the needs of the five companies in their respective markets, allowing them to reach a combined customer base of around 1.3 billion people in 50 countries.
In an additional move to strengthen the company’s position in AI computing, last week, Softbank announced an agreement to acquire US based semiconductor design company Ampere Computing Holdings LLC for $6.5 billion.
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